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Friday, September 10, 2010
Memory Industry News
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TSMC fab disrupted by Earthquake


Friday, March 05, 2010

Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) have both disclosed the impact of a 6.4-magnitude earthquake that hit southern Taiwan on March 4 disrupted production at their 12-inch facilities located in the Southern Taiwan Science Park (STSP).

TSMC yesterday issued a company filing with the Taiwan Stock Exchange (TSE) indicating its Tainan, southern Taiwan site were impacted by the quake. "Our initial estimate is that the earthquake caused the equivalent of 1.5 days loss of wafer movement for the company in total," TSMC said in a statement.

UMC, whose 12-inch Fab 12A is in the STSP, also revealed in a company filing with the TSE that some production lines were impacted as operations of certain equipment were halted. "The estimated production days affected on the company in total will be approximately 1-1.5 days," according to UMC.

Advanced Semiconductor Engineering (ASE) and ChipMOS Technologies, which both have plants in southern Taiwan, have both said that the quake did not significantly impact their production.

By: DocMemory
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