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Sunday, September 21, 2014
Industry News
Samsung starts production on 3D DDR4 memory module 8/28/2014
3D TSV is an innovative packaging technology that vertically interconnects stacked dies. With its introduction of the new TSV modules, Samsung has further strengthened its technological leadership in the “3D memory” era.
Is US Industrial sector fully recovered? 8/28/2014
“U.S. manufacturing production is 95% recovered from its September 2007 prerecession peak and will be fully recovered by the end of this year.”
JEDEC released LPDDR4 mobile DRAM standard 8/28/2014
"It is intended to meet the power, bandwidth, packaging, cost and compatibility requirements of the world's most advanced mobile systems."
Fairchild to shut down older fabs 8/28/2014
While the industry is moving toward larger wafers, these actions are expected to increase eight-inch wafer production from the current total wafer output of 30 per cent to approximately 75 per cent.
Durable good orders up 8/27/2014
Orders for durable goods rose 22.6 percent in July on a seasonally adjusted basis, the largest one-month gain on record. The strength came from a 318 percent increase in orders for civilian aircraft.
China to develope its own OS 8/27/2014
In the Chinese government's point of view, the U.S. surveillance program and Microsoft's PC OS monopoly, compounded by a mobile market dominated by Google's Android OS and Apple's iPhones, all combine as perfect justification for the Chinese government to pitch its own OS.
Lenovo turns to Taiwan for server help 8/27/2014
China Internet service players Baidu, Tencent and Alibaba are planning to develop an open structure that mainly focuses on satisfying China players' demand and Taiwan-based server players will have a chance to join the project and expand their cooperation with China Internet service players.
iPhone 6 to affect DRAM prices 8/27/2014
Supply chain work in Asia suggests PC DRAM pricing is tracking to a ~3-5% M/M increase in Sept, owing to some pre-iPhone 6 launch supply constraints. While it is too early to see actual supply impact from Samsung ramping DRAM in S3.
Hynix is ready to roll out production at Chongqing City 8/26/2014
The Chinese plant will assemble and test flash-type memory chips that are manufactured at the company's plant in Cheongju, North Chungcheong Province.
SpaceX test rocket down 8/26/2014
SpaceX spokesman John Taylor says the test flight involved a three-engine version of its reusable Falcon 9 rocket. He said an "anomaly" was detected in the rocket and it automatically self-destructed.
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