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Friday, October 31, 2014
Industry News
Single LED generates 1400 lumens 10/16/2014
single LED can be used to provide a complete low beam, several LED chips have always been needed in the past depending on the design and the type of LEDs used.
European Commission study found solar energy most cost effective source 10/16/2014
"Energy subsidies and costs in the EU," EC proves that solar energy is cost effective today, and is improving competitiveness at a rate that conventional technologies will never be able to achieve.
Intel: Microchip's slump forcast not true 10/16/2014
Microchip's CEO predicted an industry downturn, sending many tech stock prices down, including Intel's.
Apple to set image sensor design in Grenoble, France 10/16/2014
It can be seen that Apple could well be interested in turning ST into a foundry supplier of CMOS image, proximity and range-finding sensors of its own design.
Samsung insist on no chip price war next year 10/15/2014
Samsung's plan to invest 15.6 trillion won ($14.67 billion) in a new South Korea chip plant stoked concerns about the industry's profit outlook. Some investors worry that the firm could ramp up supply and undercut prices to squeeze rivals like SK Hynix Inc and Micron Technology Inc.
JPMorgan Chase CEO called for more coordination to fight cyberattacks 10/15/2014
"Cyber is a big deal," Dimon said on a call with reporters on Tuesday. "It's going to be an ongoing battle, and unfortunately battles will be lost."
Wearable chip market will be $9 billion by 2019 10/15/2014
The market will exhibit a compound annual growth rate (CAGR) of 30 per cent between 2015 and 2019, which would see chip market values of about $3.2 billion in 2015, followed by $4.1 billion, $5.3 billion and $6.9 billion in 2016, 2017 and 2018, respectively.
Superfast charging battery unvailed 10/15/2014
In the NTU's battery, the traditional graphite used for the anode in lithium-ion batteries is replaced with a new gel made from titanium dioxide. Titanium dioxide is an abundant, cheap and safe material found in soil.
New HyperRAM to use Spansion's HyperBus interface 10/14/2014
By combining HyperFlash and HyperRAM components on a single bus, chipset providers can reduce controller pincount, accommodate smaller packages, simplify PCB designs, and potentially replace or reduce DRAM.
China's SMIC prepare to bid on troubled Korean foundry 10/14/2014
So far, four potential bidders, including China's Semiconductor Manufacturing International Corp. (SMIC), have joined the race to buy Dongbu HiTek.
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