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Saturday, April 19, 2014
Industry News
Stats ChipPac's FlexLine process provides scalable WLCSP packaging 3/13/2014
FlexLine seamlessly processes multiple silicon wafer diameters in the same manufacturing line without changing equipment sets or bill of materials used in the packaging process.
Advantest offers mobile device test solution 3/13/2014
The modules use vector signal generation (VSG) and vector signal analysis (VSA) software to meet the modulation challenges presented by today's most advanced portable electronics.
Samsung offers 20nm 4Gbit DDR3 in production volume 3/12/2014
Samsung said Tuesday it is set to mass produce what it claims is the most advanced version of a type of memory commonly used in PCs and mobile devices.
China state owned company offered to buy Montage 3/12/2014
Shanghai Pudong Science and Technology Investment Co Ltd offered $21.50 per Montage share in cash, a 25 percent premium to the company's closing price on Friday. "But the price seems low, so there could be chance of topping up,"
Active Semi announed wireless power charging design 3/12/2014
The programmable nature of this core helps make products based on the PAC5220WP future proof with regard to evolving standards. It's scalable to all WPC configurations.
Xilinx announced DDR4 2400 support 3/12/2014
The UltraScale devices are based on an ASIC-class architecture that the company claims supports high I/O and memory bandwidth with power and latency reduction. d
Qualcom gets new president 3/11/2014
Qualcomm said that Aberle will oversee the mobile chip maker's global expansion and business units. Aberle has been at Qualcomm for 13 years and led the company's licensing business.
TI has DLP chipset for micro projector 3/11/2014
The 0.3-inch HD TRP DLP Pico chipset is capable of projecting a 720p video onto a wall, screen or another surface, with the module being small enough to fit into the side or end of a smartphone or tablet.
US semi companies brokered design services from small India companies 3/11/2014
Semiconductor companies such as Analog Devices (ADI) and Texas Instruments have helped more than a dozen small Indian companies over the last year, while ARM and Sandisk are in talks to facilitate big international contract wins by Indian partners.
NXP adopts "to be more Chinese" in China 3/11/2014
When Freeman, responsible for NXP's global automotive sales and marketing, was asked what drove NXP to form a fabless automotive chip joint venture in China with China's state-owned Datang Telecom Technology Co., he simply said: "We've kept thinking that we need to be more Chinese than we already are."
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